Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology-Reference-Cited by-同舟云学术

Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Published:2017-10-01 Issue:1 Volume:2017 Page:000325-000330
ISSN:2380-4505
Container-title:International Symposium on Microelectronics
language:en
Short-container-title:

Author:

Zhao Wei¹,Nakamoto Mark¹,Dhandapani Karthikeyan¹,Henderson Brian¹,Lindley Ron¹,Radojcic Riko¹,Ray Urmi¹,Gunterus Aurel¹,Schwarz Mark¹,Syed Ahmer¹,Ramachandran Vidhya¹

Affiliation:

1. Qualcomm Technologies, Inc., 5775 Morehouse drive, San Diego, CA 92121

Abstract

Abstract Electrical Chip Board Interaction (e-CBI) has emerged as a new risk in chip design as silicon die can directly interact with printed circuit board (PCB) in substrate-less wafer level packaging technology. To assess this risk Qualcomm Technologies, Inc. has converted an existing test chip to wafer level packaging technology. Both the measured data and simulation results show that e-CBI risk is significant and must be carefully managed.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

Subject

General Medicine

Link

http://meridian.allenpress.com/ism/article-pdf/2017/1/000325/2346323/isom-2017-wp11_048.pdf

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