1. Interconnect opportunities for gigascale integration;Meindl;IBM J. Res. Develop.,2002
2. A global view of interconnects;List;Microelectron. Engng,2006
3. Edelstein , D. Heidenreich , J. Goldblatt , R. Cote , W. Uzoh , C. Lustig , N. Roper , P. McDevitt , T. Motsiff , W. Simon , A. Dukovic , J. Wachnik , R. Rathore , H. Schulz , R. Su , L. Luce , S. Slattery , J. 1997 Full copper wiring in a sub-0.25 µm CMOS ULSI technology 773 776
4. Low dielectric constant materials for microelectronics;Maex;J. Appl. Phys.,2003
5. Low dielectric constant materials;Volksen;Chem. Rev.,2010