Electromigration in Pb-Free Solder Joints in Electronic Packaging

Author:

Chen Chih,Liang Shih-Wei,Chang Yuan-Wei,Hsiao Hsiang-Yao,Han Jung Kyu,Tu K. N.

Publisher

John Wiley & Sons, Ltd

Reference91 articles.

1. Recent advances on electromigration in very-large-scale-integration of interconnects;Tu;J. Appl. Phys.,2003

2. Wright , S.L. Polastre , R. Gan , H. et al 2006 Characterization of micro-bump C4 interconnects for Si-carrier SOP applications 633 640

3. Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing;Tsui;IEEE Trans. Adv. Packag.,2005

4. Brandenburg , S. Yeh , S. 1998 Electromigration studies of flip chip solder bump solder joints 337 344

5. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes;Liu;Appl. Phys. Lett.,1999

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