Interaction of Sn-Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry
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Publisher
John Wiley & Sons, Ltd
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119966203.ch4/fullpdf
Reference107 articles.
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2. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad;Alam;J. Appl. Phys.,2003
3. Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate;Yoon;J. Alloys Compd.,2004
4. Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P;Sohn;J. Electron. Mater.,2004
5. The root causes of the “Black Pad” phenomenon and avoidance tactics;Suganuma;JOM,2008
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1. Pressure dependence of the tin–phosphorus phase diagram;Monatshefte für Chemie - Chemical Monthly;2012-10-24
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