Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P-Reference-Cited by-同舟云学术

Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P

Published:2004-07 Issue:7 Volume:33 Page:790-795
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Sohn Y. C.,Yu Jin,Kang S. K.,Shih D. Y.,Choi W. K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0243-2.pdf

Reference19 articles.

1. S. Wiegele, P. Thompson, R. Lee, and E. Ramsland, Proc. IEEE Electron. Comp. Technol. Conf. (Piscataway, NJ: 1998), pp. 861–866.

2. Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson, Proc. IEEE Electron. Comp. Technol. Conf. (Piscataway, NJ: 1998), pp. 952–961.

3. J.K. Lin, A.D. Silva, D. Frear, Y. Guo, J.W. Jang, L. Li, D. Mitchell, B. Yeung, and C. Zhang, Proc. IEEE Electron. Comp. Technol. Conf. (Piscataway, NJ: 2001), pp. 455–462.

4. M.O. Alam, Y.C. Chan, and K.C. Hung, Proc. IEEE Electron. Comp. Technol. Conf. (Piscataway, NJ: 2002), pp. 1650–1657.

5. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K.M. Chong, and O. Villalobos, Proc. IEEE Electron. Comp. Technol. Conf. (Piscataway, NJ: 2002), pp. 732–739.

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