Lead-Free Solders: Materials Reliability for Electronics
Author:
Publisher
John Wiley & Sons, Ltd
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119966203/fullpdf
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints;Journal of Electronic Materials;2022-11-29
2. The Effect of Electric-Thermal-Vibration Stress Coupling on the Reliability of Sn-Ag-Cu Solder Joints;Journal of Electronic Materials;2021-11-10
3. Co/(Ag-41.0 at.%Sb)1−xCox and Ni/(Ag-41.0 at.%Sb)1−xNix Interfacial Reactions;Journal of Electronic Materials;2019-06-25
4. Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions;Journal of Materials Science: Materials in Electronics;2019-05-31
5. Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs;Journal of Materials Science: Materials in Electronics;2018-03-14
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