Funder
the National Natural Science Foundation of China
Equipment Pre-Research Project of China
College Students' Innovative Entrepreneurial Training Plan Program of China
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. J.H. Lau, State of the art of lead-free solder joint reliability. J. Electron. Packag. (2021). https://doi.org/10.1115/1.4048037.
2. K.N. Subramanian, Lead-Free Solders; Materials Reliability for Electronics (Chichester: Wiley, 2012).
3. L.H. Xu and J.H.L. Pang, in 56th Electronic Components and Technology Conference (2006), p. 8.
4. J.L. Yang, Y.P. Lei, J. Lin, and H. Zhang, The influence of silver content on the reliability of lead-free solder joints under random vibration conditions. Dianzi Yuanjian Yu Cailiao (2012). https://doi.org/10.14106/j.cnki.1001-2028.2012.09.009.
5. M. Basit, S. Ahmed, M. Motalab, J.C. Roberts, J.C. Suhling, and P. Lall, in 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2016), p. 440.
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