P‐12.10: Study on Flip‐Chip Structure of GaN‐Based Micro‐LED-Reference-Cited by-同舟云学术

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P‐12.10: Study on Flip‐Chip Structure of GaN‐Based Micro‐LED

Published:2021-02 Issue:S1 Volume:52 Page:628-631
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:SID Symposium Digest of Technical Papers

Author:

Feng Yang¹,Liu Chuanbiao¹,Cheng Zhuo²,Liu Zhaojun¹

Affiliation:

1. Dept. of Electrical and Electronic Engineering, Southern University of Science and Technology Shenzhen Guangdong China

2. Shenzhen CreatLED Technology Limited Shenzhen Guangdong China

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.14576

Reference13 articles.

1. Flip the Chip

2. Solid Logic Technology: Verdatile High Performance Microelectronics IBM [J];Davis E;Journal of Research & Development,1987

3. Resin-Insertion Effect on Thermal Cycle Resis-tivity of Flip-Chip Mounted LSI Devices [J];Nakano F;Journal of Research & Development,1987

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1. Observation of two different temperature-dependent behaviors of the defects in III-nitride micro-LEDs;AIP Advances;2023-04-01

2. Improved Optical and Electrical Characteristics of GaN-Based Micro-LEDs by Optimized Sidewall Passivation;Micromachines;2022-12-21

3. FPGA Synthesis of Ternary Memristor-CMOS Decoders for Active Matrix Microdisplays;IEEE Transactions on Circuits and Systems I: Regular Papers;2022-09

4. Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps & Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations;Silicon;2021-10-26

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