Preparation and characterization of antistatic packaging for electronic components based on poly(lactic acid)/carbon black composites-Reference-Cited by-同舟云学术

Preparation and characterization of antistatic packaging for electronic components based on poly(lactic acid)/carbon black composites

Published:2018-11-01 Issue:13 Volume:136 Page:47273
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Silva Thaís Ferreira da¹^ORCID,Menezes Fernanda¹,Montagna Larissa Stieven¹,Lemes Ana Paula¹,Passador Fabio Roberto¹

Affiliation:

1. Universidade Federal de São Paulo (UNIFESP), Polymer and Biopolymer Technology Laboratory (TecPBio); Talim, 330, São José dos Campos SP 12231-280 Brazil

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.47273/fullpdf

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2. An Electrostatic Discharge Protection Circuit Technique for the Mitigation of Single-Event Transients in SiGe BiCMOS Technology

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