Basic Mechanisms in Plasma Etching
Author:
Publisher
Wiley
Subject
Condensed Matter Physics
Reference41 articles.
1. Comparison of Aluminum Etch Rates in Carbon Tetrachloride and Boron Trichloride Plasmas
2. Aluminum Etching in Carbon Tetrachloride Plasmas
3. Tungsten Etching in CF 4 and SF 6 Discharges
4. (Invited) Mechanism of Dry Development and Dry Etch Resistance of Resist
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