Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing-Reference-Cited by-同舟云学术

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Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing

Published:2022-11-03 Issue:51 Volume:18 Page:2205302
ISSN:1613-6810
Container-title:Small
language:en
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Author:

Menétrey Maxence¹^ORCID,Koch Lukas¹,Sologubenko Alla²^ORCID,Gerstl Stephan²^ORCID,Spolenak Ralph¹^ORCID,Reiser Alain¹³^ORCID

Affiliation:

1. Laboratory for Nanometallurgy Department of Materials ETH Zürich Vladimir‐Prelog‐Weg 1‐5/10 Zürich 8093 Switzerland

2. Scientific Center for Optical and Electron Microscopy (ScopeM) ETH Zürich Otto‐Stern‐Weg 3 Zürich 8093 Switzerland

3. Department of Materials Science and Engineering Massachusetts Institute of Technology Cambridge MA 02139 USA

Funder

Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.202205302

Reference57 articles.

1. Printing, folding and assembly methods for forming 3D mesostructures in advanced materials

2. Additive Manufacturing of Metal Structures at the Micrometer Scale

3. Three-Dimensional μ-Printing: An Enabling Technology

4. Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical additive manufacturing of micro/nano functional metals;Materials Today Sustainability;2024-09

2. Free-space direct nanoscale 3D printing of metals and alloys enabled by two-photon decomposition and ultrafast optical trapping;Nature Materials;2024-08-21

3. On the Resolution Limit of Electrohydrodynamic Redox 3D Printing;Small;2024-08-02

4. Material Extrusion 3D Printing of Micro-Porous Copper-Based Structure for Water Filters;Machines;2024-07-12

5. Direct In‐ and Out‐of‐Plane Writing of Metals on Insulators by Electron‐Beam‐Enabled, Confined Electrodeposition with Submicrometer Feature Size;Small Methods;2024-01-06

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