Analysis of multi-gigabits signal integrity through clock H-tree-Reference-Cited by-同舟云学术

Analysis of multi-gigabits signal integrity through clock H-tree

Published:2012-02-28 Issue:5 Volume:41 Page:535-549
ISSN:0098-9886
Container-title:International Journal of Circuit Theory and Applications
language:en
Short-container-title:Int. J. Circ. Theor. Appl.

Author:

Eudes Thomas¹,Ravelo Blaise¹

Affiliation:

1. IRSEEM (Research Institute on Electronic and Embedded Systems), EA 4353; at the graduate School of Engineering ESIGELEC; Av. Galilée, BP 10024; 76801; Saint Etienne du Rouvray Cedex; France

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Science Applications,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/cta.818/fullpdf

Reference59 articles.

1. Slope Interconnect Effort: Gate-Interconnect Interdependent Delay Modeling for Early CMOS Circuit Simulation;Hwang;IEEE Transactions on Circuits and Systems I,2009

2. Serial-Link Bus: A Low-Power On-Chip Bus Architecture;Ghoneima;IEEE Transactions on Circuits and Systems I,2009

3. Optimization of Driver Preemphasis for On-Chip Interconnects;Yun;IEEE Transactions on Circuits and Systems I,2009

4. Performance Optimization of VLSI Interconnect Layout;Cong;Integration, the VLSI Journal,1996

5. A Tree-Topology Multiplexer for Multiphase Clock System;Hungwen;IEEE Transactions on Circuits and Systems I,2009

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