TAN modelling of HH-shape microstrip interconnect tree-Reference-Cited by-同舟云学术

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TAN modelling of HH-shape microstrip interconnect tree

Published:2020-10-05 Issue:2 Volume:35 Page:139-149
ISSN:0920-5071
Container-title:Journal of Electromagnetic Waves and Applications
language:en
Short-container-title:Journal of Electromagnetic Waves and Applications

Author:

Randriatsiferana Rivo¹^ORCID,Ramifidisoa Lucius²,Lalléchère Sébastien³^ORCID,Xu Zhifei⁴,Ravelo Blaise⁵^ORCID

Affiliation:

1. University of La Reunion, LE2P Lab, Saint Denis, France

2. ENSET, University of Antsiranana, Antsiranana, Madagascar

3. Université Clermont Auvergne (UCA), CNRS, SIGMA Clermont, Institut Pascal, Aubière, France

4. EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA

5. Nanjing University of Information and Science Technology, Nanjing, People’s Republic of China

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,General Physics and Astronomy,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/09205071.2020.1828183

Reference21 articles.

1. Beyene W. Design and analysis of high-speed links. Tutorial, Proc. of 17th IEEE Workshop on Signal and Power Integrity, Paris, France, 12–15 May 2013.

2. TRANSIENT RESPONSE CHARACTERIZATION OF THE HIGH-SPEED INTERCONNECTION RLCG-MODEL FOR THE SIGNAL INTEGRITY ANALYSIS

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