Electrically Robust Single‐Crystalline WTe 2 Nanobelts for Nanoscale Electrical Interconnects-Reference-Cited by-同舟云学术

Electrically Robust Single‐Crystalline WTe 2 Nanobelts for Nanoscale Electrical Interconnects

Published:2018-12-12 Issue:3 Volume:6 Page:1801370
ISSN:2198-3844
Container-title:Advanced Science
language:en
Short-container-title:Adv. Sci.

Author:

Song Seunguk¹,Kim Se‐Yang¹,Kwak Jinsung¹,Jo Yongsu¹,Kim Jung Hwa¹,Lee Jong Hwa¹,Lee Jae‐Ung²,Kim Jong Uk³,Yun Hyung Duk¹,Sim Yeoseon¹,Wang Jaewon¹,Lee Do Hee¹,Seok Shi‐Hyun¹,Kim Tae‐il³,Cheong Hyeonsik²,Lee Zonghoon¹,Kwon Soon‐Yong¹^ORCID

Affiliation:

1. School of Materials Science and Engineering & Low‐Dimensional Carbon Materials CenterUlsan National Institute of Science and Technology (UNIST) Ulsan 44919 Republic of Korea

2. Department of PhysicsSogang University Seoul 04107 Republic of Korea

3. School of Chemical EngineeringSungkyunkwan University (SKKU) Suwon 16419 Republic of Korea

Funder

National Research Foundation of Korea

Ministry of Science ICT and Future Planning

Publisher

Wiley

Subject

General Physics and Astronomy,General Engineering,Biochemistry, Genetics and Molecular Biology (miscellaneous),General Materials Science,General Chemical Engineering,Medicine (miscellaneous)

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/advs.201801370

Reference45 articles.

1. A. Kolodny Y. Shacham‐Diamand T. Osaka M. Datt T. Ohba Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications 2009 Springer New York USA 39 62

2. Intercalation Doped Multilayer-Graphene-Nanoribbons for Next-Generation Interconnects

3. Breakdown current density in h-BN-capped quasi-1D TaSe3metallic nanowires: prospects of interconnect applications

4. Reliability challenges in 3D IC packaging technology

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