Investigation of impedance compensation in radio frequency circuits with bonding wire-Reference-Cited by-同舟云学术

Investigation of impedance compensation in radio frequency circuits with bonding wire

Published:2022-03-16 Issue:6 Volume:32 Page:
ISSN:1096-4290
Container-title:International Journal of RF and Microwave Computer-Aided Engineering
language:en
Short-container-title:Int J RF Mic Comp-Aid Eng

Author:

Wang Ziren¹,Gao Jinchun¹^ORCID,Flowers George T.²,Song Kaixuan¹,Yi Wei³,Cheng Zhongyang³

Affiliation:

1. Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering Beijing University of Posts and Telecommunications Beijing China

2. Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn Alabama USA

3. Materials Research and Education Center Auburn University Auburn Alabama USA

Funder

National Natural Science Foundation of China

Publisher

Hindawi Limited

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mmce.23156

Reference18 articles.

1. Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

2. Modeling and minimizing the inductance of bond wire interconnects;Ndip I;IEEE Workshop Signal Power Integr,2013

3. The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits

4. Modeling and characterization of the bonding-wire interconnection

5. S‐parameter extraction of bond wires based on EM field simulations of computed tomography‐generated 3D CAD models;Hillebrand J;IEEE Workshop Signal Power Integr,2012

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2. Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

3. Investigation of impedance compensation for inductive via holes using capacitors;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20