Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
2. Technische Universitaet Berlin, Berlin, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/15/7084704/06990557.pdf?arnumber=6990557
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