Delamination and Reliability Issues in Packaged Devices-Reference-Cited by-同舟云学术

Delamination and Reliability Issues in Packaged Devices

Published:2014-09-12 Issue: Volume: Page:267-312
ISSN:
Container-title:Adhesion in Microelectronics
language:
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Author:

Lei Wei-Sheng,Kumar Ajay

Publisher

John Wiley & Sons, Inc.

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781118831373.ch7/fullpdf

Reference101 articles.

1. Mechanics of Microelectronics

2. J. W. Hutchinson Stresses and failure modes in thin films and multilayers: Notes for a DCAMM Course, Technical University of Denmark (1996) http://www.seas.harvard.edu/hutchinson/papers/462-5.pdf

3. Die singulation technologies for advanced packaging;Lei;J. Vac. Sci. Technol. B,2012

4. R. J. Usell , Jr S. A. Smiley Experimental and mathematical determination of mechanical strains within plastic IC packages and their effect on devices during environmental tests, in: Proceedings of IEEE International Reliability Physics Symposium , pp. 65-73 (1981)

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