Mechanics of Microelectronics

Author:

Zhang G. Q.,Van Driel W. D.,Fan X. J.

Publisher

Springer Netherlands

Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications;Energies;2023-08-08

2. Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Literature Review of Electronic Packaging Technology and Residual Stress;Open Journal of Applied Sciences;2023

4. Virtual Prototyping Approach for Package Delamination Risk Assessment under Simulated High Temperature Exposure using Finite Element Analysis;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19

5. Interface StressAnalysis Based on Warpage Characterization in a Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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