Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices-Reference-Cited by-同舟云学术

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Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices

Published:2019-07-15 Issue:40 Volume:29 Page:1903687
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Martin Andrew¹,Chang Boyce S.¹,Martin Zachariah²,Paramanik Dipak²,Frankiewicz Christophe¹,Kundu Souvik³,Tevis Ian D.²,Thuo Martin¹³⁴⁵^ORCID

Affiliation:

1. Department of Materials Science and EngineeringIowa State University Ames IA‐50010 USA

2. SAFI‐Tech Inc. Ames IA‐50011 USA

3. Department of Electrical and Computer EngineeringIowa State University Ames IA‐50010 USA

4. Microelectronics Research CenterIowa State University Ames IA‐50010 USA

5. Center for Crop Utilization ResearchIowa State University Ames IA‐50010 USA

Funder

Iowa State University

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.201903687

Reference41 articles.

1. Flexible integration of free-standing nanowires into silicon photonics

2. Flash-induced nanowelding of silver nanowire networks for transparent stretchable electrochromic devices

3. Organic printed photonics: From microring lasers to integrated circuits

4. Nanoparticle-enabled phase control for arc welding of unweldable aluminum alloy 7075

5. Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

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