Failure analysis of solder joints with a damage-coupled viscoplastic model
Author:
Publisher
Wiley
Subject
Applied Mathematics,General Engineering,Numerical Analysis
Reference14 articles.
1. Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints
2. A Unified Creep-Plasticity Theory for Solder Alloys
3. Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*
4. A Thermodynamic Framework for Damage Mechanics of Solder Joints
5. Constitutive modeling of viscoplastic damage in solder material. IUTAM Symposium on Creep in Structures. Dordrecht: Kluwer, 2000; 131-140.
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1. Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling;Computer Modeling in Engineering & Sciences;2021
2. A critical review of constitutive models for solders in electronic packaging;Advances in Mechanical Engineering;2017-08
3. In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints;Electronic Materials Letters;2016-12-09
4. Finite element method implementation of a nonlocal viscoplastic model with consideration of temperature dependence;The Journal of Strain Analysis for Engineering Design;2014-05-14
5. Structural benchmark creep and creep damage testing for finite element analysis with material tension–compression asymmetry and symmetry;Computers & Structures;2012-06
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