Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling-Reference-Cited by-同舟云学术

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Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling

Published:2021 Issue:2 Volume:128 Page:639-668
ISSN:1526-1506
Container-title:Computer Modeling in Engineering & Sciences
language:en
Short-container-title:

Author:

Yang Hung-Chun,Chiu Tz-Cheng

Publisher

Computers, Materials and Continua (Tech Science Press)

Subject

Computer Science Applications,Modelling and Simulation,Software

Link

https://www.techscience.com/CMES/v128n2/43931/pdf

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions;Materials;2023-06-09

2. Analytical Models of Concrete Fatigue: A State-of-the-Art Review;Computer Modeling in Engineering & Sciences;2023

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