Preparation and properties of glass cloth-reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference28 articles.
1. A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology
2. Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs
3. Mcgregor, D. R.; Cox, G. S.; Lantzer, T. D. Proceedings of 2nd Inernational Conference on Embedded Passives, Sab Jose, CA, June 15-17, 2004.
4. Development of a new improved high performance flip chip BGA package
5. Packaging Reliability for High Temperature Electronics: A Materials Focus
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Adsorptive recovery of precious metals from aqueous solution using nanomaterials – A critical review;Coordination Chemistry Reviews;2021-10
2. Deposition of thin films on glass fiber fabrics by atmospheric pressure plasma jet;Surface and Coatings Technology;2020-12
3. Present status of hybrid materials for potable water decontamination: a review;Environmental Science: Water Research & Technology;2020
4. Semi-aromatic thermosetting polyimide resins containing alicyclic units for achieving low melt viscosity and low dielectric constant;Reactive and Functional Polymers;2020-01
5. A new method for an efficient porous carbon/Fe3O4 composite based electromagnetic wave absorber derived from a specially designed polyimide;Composites Part B: Engineering;2018-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3