Semi-aromatic thermosetting polyimide resins containing alicyclic units for achieving low melt viscosity and low dielectric constant-Reference-Cited by-同舟云学术

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Semi-aromatic thermosetting polyimide resins containing alicyclic units for achieving low melt viscosity and low dielectric constant

Published:2020-01 Issue: Volume:146 Page:104411
ISSN:1381-5148
Container-title:Reactive and Functional Polymers
language:en
Short-container-title:Reactive and Functional Polymers

Author:

Wang Zhen-he,Fang Guang-Qiang,He Jian-jun,Yang Hai-xia,Yang Shi-yong

Funder

National Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Polymers and Plastics,General Chemical Engineering,Biochemistry,Environmental Chemistry,General Chemistry

Reference37 articles.

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2. Printed circuit board industry;LaDou;Int. J. Hyg. Environ. Health,2006

3. Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates;Weng;J. Materi. Sci. Mater. Electronics,2018

4. Thermally stable siloxane hybrid matrix with low dielectric loss for copper-clad laminates for high-frequency applications;Kim;ACS Appl. Mater. Interfaces,2016

5. Low dielectric thermoset. I. Synthesis and properties of novel 2,6-dimethyl phenol-dicyclopentadiene epoxy;Lin;J. Appl. Polym. Sci.,2003

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2. Semiaromatic Poly(ester imide) Copolymers with Alicyclic Diamines for Low-K Properties at a High Frequency of 10–40 GHz;ACS Applied Polymer Materials;2024-09-09

3. Preparation of polyimide films with ultralow dielectric loss at high frequency by reducing intermolecular friction;Polymer;2024-09

4. Decoding high-frequency dielectric loss of Poly(ester imide)s: Molecular simulation and experiment validation;Polymer;2024-08

5. Molecular Chain Flexibility and Dielectric Loss at High-Frequency: Impact of Ester Bond Arrangement in Poly(ester imide)s;Chinese Journal of Polymer Science;2024-06-05

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