Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs-Reference-Cited by-同舟云学术

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs

Published:2005-03 Issue:3-4 Volume:45 Page:567-574
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shimoto Tadanori,Baba Kazuhiro,Matsui Koji,Tsukano Jun,Maeda Takehiko,Oyachi Kenji

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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3. Shimoto T, Kikuchi K, Honda H, Kata K, Baba K, Matsui K. High-performance flip-chip BGA based on multi-layer thin-film packaging technology. In: Proceedings of the 2002 IMAPS. p. 10–5

4. Microelectronic systems packaging technology for the 21st century;Tummala;Adv. Microelectron.,1999

5. Enomoto R, Asai M, Hirose N. High density MLB using additive and build-up process. In: Proceedings of the 1998 IMAPS. p. 403–8

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