Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages

Published:2008 Issue:3 Volume:109 Page:2016-2022
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Gui D. Y.,Ernst L. J.,Jansen K. M. B.,Yang D. G.,Goumans L.,Bressers H. J. L.,Janssen J. H. J.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference9 articles.

1. In Proceedings of the 44th ECTC, IEEE, Washington, DC, 1994; p 102.

2. Warpage of Plastic IC Packages as a Function of Processing Conditions

3. Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

4. ;;;;;; In 2004 Electronic Components and Technology Conference, IEEE, Las Vegas, NV, 2004; p 98.

5. Thermoviscoelastic analysis of residual curing stresses and the influence of autoclave pressure on these stresses in carbon/epoxy laminates

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Condition Monitoring in Micro-Injection Moulding;Micro and Precision Manufacturing;2017-10-17

2. Metamodel-based design optimization of injection molding process variables and gates of an automotive glove box for enhancing its quality;Journal of Mechanical Science and Technology;2016-04

3. Simultaneous Control of Birefringence and Warpage for Thermoplastic Optical Lenses Fabricated Using Microinjection Molding;Polymer-Plastics Technology and Engineering;2015-05-13

4. Influence of Injection and Cavity Pressure on the Demoulding Force in Micro-Injection Moulding;Journal of Manufacturing Science and Engineering;2014-04-11

5. Study on the fluid/structure interaction at different inlet pressures in molded packaging;Microelectronic Engineering;2011-10

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3