Reliable Patterning, Transfer Printing and Post‐Assembly of Multiscale Adhesion‐Free Metallic Structures for Nanogap Device Applications-Reference-Cited by-同舟云学术

Reliable Patterning, Transfer Printing and Post‐Assembly of Multiscale Adhesion‐Free Metallic Structures for Nanogap Device Applications

Published:2020-06-22 Issue:32 Volume:30 Page:2002549
ISSN:1616-301X
Container-title:Advanced Functional Materials
language:en
Short-container-title:Adv. Funct. Mater.

Author:

Chen Yiqin¹,Shu Zhiwen²,Feng Zhanyong²,Kong Ling’an³,Liu Yuan³,Duan Huigao⁴^ORCID

Affiliation:

1. College of Mechanical and Vehicle EngineeringNational Engineering Research Center for High Efficiency GrindingHunan University Changsha 410082 China

2. State Key Laboratory of Advanced Design and Manufacturing for Vehicle BodyCollege of Mechanical and Vehicle EngineeringHunan University Changsha 410082 China

3. School of Physics and ElectronicsHunan University Changsha 410082 China

4. College of Mechanical and Vehicle EngineeringNational Engineering Research Center for High Efficiency Grinding and Advanced Manufacturing Laboratory of Micro‐nano Optical DevicesShenzhen Research InstituteHunan University Changsha 410082 China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.202002549

Reference41 articles.

1. Nanoplasmonics: Classical down to the Nanometer Scale

2. Free-Standing Optical Gold Bowtie Nanoantenna with Variable Gap Size for Enhanced Raman Spectroscopy

3. Sub-10 nm Carbon Nanotube Transistor