A p‐GaN‐Gated Hybrid Anode Lateral Diode with a Thicker AlGaN Barrier Layer

Author:

Su Shuai12ORCID,Zhong Yaozong12,Zhou Yu2,Gao Hongwei2,Zhan Xiaoning2,Chen Xin13,Guo Xiaolu12,Sun Qian12,Zhang Zihui3,Bi Wengang3,Yang Hui12

Affiliation:

1. School of Nano Technology and Nano BionicsUniversity of Science and Technology of China Hefei 230026 China

2. Key Laboratory of Nanodevices and ApplicationsSuzhou Institute of Nano-Tech and Nano-BionicsChinese Academy of Sciences (CAS) Suzhou 215123 China

3. State Key Laboratory of Reliability and Intelligence of Electrical EquipmentHebei University of Technology Tianjin 201900 China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Natural Science Foundation of Jiangxi Province

China Postdoctoral Science Foundation

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. GaN Power Transistors on Si Substrates for Switching Applications

2. A GaN HEMT Structure Allowing Self-Terminated, Plasma-Free Etching for High-Uniformity, High-Mobility Enhancement-Mode Devices

3. GaN on Si Technologies for Power Switching Devices

4. Single-Chip Boost Converter Using Monolithically Integrated AlGaN/GaN Lateral Field-Effect Rectifier and Normally Off HEMT

5. G. F.Tang M. H.Kwan Z. F.Zhang.J. B.He J. C.Lei R. Y.Su F. W.Yao Y. M.Lin J. L.Yu T.Yang C. H.Chern T.Tsai H. C.Tua A.Kalnitsky K. J.Chen inProc. of 30th Int. Symp. on Power Semiconductor Devices and ICs IEEE Chicago IL2018 76.

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