Liquid Metal‐Printed Semiconductors

Author:

Song Yujia123ORCID,Li Jingyi123,Wang Ju123,Du Bangdeng123ORCID,Liu Jing1234ORCID

Affiliation:

1. Key Laboratory of Cryogenic Science and Technology Technical Institute of Physics and Chemistry Chinese Academy of Sciences Beijing 100190 China

2. Beijing Key Lab of CryoBiomedical Engineering Technical Institute of Physics and Chemistry Chinese Academy of Sciences Beijing 100190 China

3. School of Future Technology University of Chinese Academy of Sciences Beijing 100049 China

4. Department of Biomedical Engineering School of Medicine Tsinghua University Beijing 100084 China

Abstract

Liquid metal (LM) electronic ink (e‐ink) is a promising new‐generation material for printed electronics. Extended from this ideal platform, such ink can be post‐processed or loaded with semiconductor nanoparticles to further make semiconductors in the forms of dots, wires, and films on its surface. In this way, targeted semiconductors can be quickly fabricated and patterned as desired with low cost at around room temperature. This leads to the unconventional bottom‐up strategy for direct manufacture of functional devices. Along this direction, a series of p–n junction diodes, field‐effect transistors, and light‐emitting devices have been developed. LM‐printed semiconductor would significantly innovate the classical processes of preparing integrated circuits and electronic devices. To push forward further progress of this cutting‐edge frontier, this article is dedicated to present an overview of LM‐printed semiconductor. The material category of LM semiconductor e‐inks and their synthesis approaches is introduced. Then the core strategies toward printing semiconductors are systematically outlined. Following that, the typical printed semiconductor materials and electronic devices thus constructed as well as their potential applications are summarized. Finally, scientific and technical challenges thus raised are interpreted. Perspective in the area is given.

Publisher

Wiley

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