Prediction of planarization property in copper film chemical mechanical polishing via response surface methodology and convolutional neural network-Reference-Cited by-同舟云学术

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Prediction of planarization property in copper film chemical mechanical polishing via response surface methodology and convolutional neural network

Published:2021-08-11 Issue: Volume: Page:
ISSN:2688-4011
Container-title:Nano Select
language:en
Short-container-title:Nano Select

Author:

Zhou Jiakai¹²,Niu Xinhuan¹²^ORCID,Zhang Tianlin³,Wang He⁴,Yang Chenghui¹²,Zhang Yinchan¹²,Wang Wantang¹²,Wang Zhi¹²,Zhu Yebo¹²,Hou Ziyang¹²,Wang Ru¹²

Affiliation:

1. School of Electronics and Information Engineering Hebei University of Technology Tianjin People's Republic of China

2. Tianjin Key Laboratory of Electronic Materials and Devices Tianjin People's Republic of China

3. Department of Computer Science The University of Manchester Manchester UK

4. School of Computer Science and Technology Xidian University Xi'an People's Republic of China

Publisher

Wiley

Subject

General Medicine

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/nano.202100028

Reference65 articles.

1. Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

2. Degradation of inhibitor in alkaline cleaning solution for post-Cu CMP cleaning

3. Atomistic Mechanisms of Chemical Mechanical Polishing of a Cu Surface in Aqueous H2O2: Tight-Binding Quantum Chemical Molecular Dynamics Simulations

4. Atomistic Insights into Cu Chemical Mechanical Polishing Mechanism in Aqueous Hydrogen Peroxide and Glycine: ReaxFF Reactive Molecular Dynamics Simulations

5. Stabilization of Alumina Slurry for Chemical−Mechanical Polishing of Copper

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization of electrode preparation conditions by response surface methodology for improved formic acid electrooxidation on Pd/MWCNT/GCE;Ionics;2023-08-21

2. Optimization of electrode preparation conditions by response surface methodology for improved formic acid electrooxidation on Pd/MWCNT/GCE;2023-06-08

3. Study on the surface interaction mechanism, corrosion inhibition effect and the synergistic action of potassium oleate and fatty alcohol polyoxy ethylene ether on copper film chemical mechanical polishing for giant large scale integrated circuit;Thin Solid Films;2023-06

4. A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits;The International Journal of Advanced Manufacturing Technology;2023-01-03

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