Depth profile analysis of aluminium metallization in microelectronics: Optimization of depth resolution
Author:
Publisher
Wiley
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference43 articles.
1. Interactions in metallization systems for integrated circuits
2. Diffusion barriers in thin films
3. CVD-W deposition and dry etch processes for planarized metallizations and tungsten interconnect techniques
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