CVD-W deposition and dry etch processes for planarized metallizations and tungsten interconnect techniques

Author:

Berthold J.,Wieczorek C.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference10 articles.

1. Proc. 5th Intern. V-MIC Conf.;Kaanta,1988

2. Plasma Etching Methods for the Formation of Planarized Tungsten Plugs Used in Multilevel VLSI Metallizations

3. M. Grief, T. Doan, H.J.W. van Houtum and J.M.F.G. van Laarhoven, Philips Patent PHQ88/012.

4. Proc. 4th Intern. V-MIC Conf.;Lee,1987

5. Proc. 5th V-MIC Conf.;de Graaf,1988

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