Film Stress of Amorphous Hydrogenated Carbon on Biaxially Oriented Polyethylene Terephthalate-Reference-Cited by-同舟云学术

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Film Stress of Amorphous Hydrogenated Carbon on Biaxially Oriented Polyethylene Terephthalate

Published:2015-06-02 Issue:9 Volume:12 Page:896-904
ISSN:1612-8850
Container-title:Plasma Processes and Polymers
language:en
Short-container-title:Plasma Process. Polym.

Author:

Bahre Hendrik¹,Behm Henrik²,Grochla Dario³,Böke Marc¹,Dahlmann Rainer²,Hopmann Christian²,Ludwig Alfred³,Winter Jörg¹

Affiliation:

1. Institute for Experimental Physics II, Application Oriented Plasma Physics; Ruhr-Universität Bochum; Universitätsstraße 150 44801 Bochum Germany

2. Institute of Plastics Processing; RWTH Aachen University; Pontstraße 49 52062 Aachen Germany

3. Institute for Materials, Chair for MEMS Materials; Ruhr-Universität Bochum; Universitätsstraße 150 44801 Bochum Germany

Publisher

Wiley

Subject

Polymers and Plastics,Condensed Matter Physics

Reference36 articles.

1. Chemical vapour deposition of coatings

2. Plasma-deposited diamondlike carbon and related materials

3. Deposition and properties of diamondlike carbon films produced in microwave and radio‐frequency plasma

4. Deposition of Si-DLC films with high hardness, low stress and high deposition rates

5. Critical ion energy and ion flux in the growth of films by plasma‐enhanced chemical‐vapor deposition

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1. Overview on the Antimicrobial Activity and Biocompatibility of Sputtered Carbon-Based Coatings;Processes;2021-08-18

2. Comparative study of the residual stress development in HMDSN-based organosilicon and silicon oxide coatings;Journal of Physics D: Applied Physics;2020-06-15

3. Improved homogeneity of plasma and coating properties using a lance matrix gas distribution in MW-PECVD;Journal of Coatings Technology and Research;2018-10-05

4. PEALD of SiO2 and Al2O3 Thin Films on Polypropylene: Investigations of the Film Growth at the Interface, Stress, and Gas Barrier Properties of Dyads;ACS Applied Materials & Interfaces;2018-02-19

5. Si micro-cantilever sensor chips for space-resolved stress measurements in physical and plasma-enhanced chemical vapour deposition;Sensors and Actuators A: Physical;2018-02

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