Preparation and properties of hollow silica tubes/bismaleimide/diallylbisphenol A composites with improved toughness, dielectric properties, and flame retardancy-Reference-Cited by-同舟云学术

Preparation and properties of hollow silica tubes/bismaleimide/diallylbisphenol A composites with improved toughness, dielectric properties, and flame retardancy

Published:2011-02-01 Issue:3 Volume:23 Page:326-335
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polym. Adv. Technol.

Author:

Yao Wei,Gu Aijuan,Liang Guozheng,Zhuo Dongxian,Yuan Li

Publisher

Wiley

Subject

Polymers and Plastics

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pat.1872/fullpdf

Reference32 articles.

1. Handbook of 3D Integration

2. Polycondensation of bismaleimides with aromatic diamines

3. Enhancement of the processibility of bismaleimide resins via copolymerisation with allyl organo-boron compounds

4. Viscoelastic phase separation in polyethersulfone modified bismaleimide resin

5. Bismaleimide resin modified with diallyl bisphenol A and diallylp-phenyl diamine for resin transfer molding

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of ultra-microporous COF for effectively enhancing the dielectric and fire resistance of bismaleimide based electronic packaging material;Chemical Engineering Journal;2024-02

2. Flame-retardant Bismaleimide resin constructed by hyperbranched carborane segments;Polymer Degradation and Stability;2023-12

3. A Bis-Stabilized Interface Strategy for Low-k Benzocyclobutene-Based Hollow Silica Nanocomposites;ACS Applied Polymer Materials;2023-05-02

4. Poly(silylene arylacetylene)s containing hexafluoroisopropylidene with attractive mechanical properties and dielectric performance for wave-transparent composites;Materials Chemistry Frontiers;2023

5. Construction of hierarchical Ti3C2TX@PHbP-PHC architecture with enhanced free-radical quenching capability: Effective reinforcement and fire safety performance in bismaleimide resin;Chemical Engineering Journal;2022-01