Design of ultra-microporous COF for effectively enhancing the dielectric and fire resistance of bismaleimide based electronic packaging material

Author:

Zhou Yifan,Liu Wei,Ye WenbinORCID,Li Shengzhe,Chu Fukai,Hu Weizhao,Song Lei,Hu YuanORCID

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference35 articles.

1. Mof-derived strategy to obtain cucoox functionalized ho-bn: a novel design to enhance the toughness, fire safety and heat resistance of bismaleimide resin;Zhou;Chem. Eng. J.,2022

2. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging;Li;Mater. Today Phys.,2022

3. Glass fiber reinforced bismaleimide/epoxy batio3 nano composites for high voltage applications;Unnikrishnan;Polym. Test,2020

4. Multi-functional ladderlike polysiloxane: synthesis, characterization and its high performance flame retarding bismaleimide resins with simultaneously improved thermal resistance, dimensional stability and dielectric properties;Chen;J. Mater. Chem. A,2014

5. A review on synthesis, structural, flame retardancy and dielectric properties of hexasubstituted cyclotriphosphazene;Usri;Polymers,2021

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