Preparation of polyimide bond-linked covalent organic frameworks as resin-compatible nanofillers for copper clad laminates with improved thermal and electrical performances-Reference-Cited by-同舟云学术

Preparation of polyimide bond-linked covalent organic frameworks as resin-compatible nanofillers for copper clad laminates with improved thermal and electrical performances

Published:2024-05-27 Issue:21 Volume:59 Page:9319-9332
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Sun He,Wang Cheng,Zhang Xiao,Wang Fengwei^ORCID

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s10853-024-09776-1.pdf

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