Affiliation:
1. Key Laboratory for Specially Functional Materials and Related Technology (Ministry of Education), School of Materials Science and Engineering East China University of Science and Technology Shanghai China
Abstract
AbstractThe low toughness and high softening temperature of bismaleimide (BMI) resin limit its application in the field of electronic packaging. Herein, a series of flexible BMI resins with maleic anhydride terminated were synthesized via the imide reaction between dianhydrides and bio‐based 8,8′‐(4‐hexyl‐6‐octylcyclohexane‐1,3‐diyl)bis(octane‐1‐amine) (HOBOA). The degree of polymerization of these BMI resins was controlled to 1, 3, and 5 by adjusting the molar ratio of dianhydrides to HOBOA. These BMI resins show a low softening temperature below 100°C. These BMI resins were cured by the thermal procedure as follows: 145°C/2 h, 185°C/2 h, 225°C/2 h, and 275°C/2 h. The thermal decomposition temperature of cured resins is above 395°C. The tensile testing results demonstrated that cured resins exhibit a high elongation at break of around 60%. The dielectric constant of the cured resins is between 2.72 and 3.09 at room temperature. The water absorption rate of cured resins is less than 0.7% after being soaked in water for 30 days. After the cured resins were soaked separately in acid and alkali, the tensile strength retention rate reaches more than 90%. Additionally, the lap shear strength of cured resins coated on 7075 aluminum alloy exceeds 7.0 MPa.
Funder
Fundamental Research Funds for the Central Universities