Thermally enhanced GaN hybrid-IC power amplifier using embedded IC process in a copper sheet-Reference-Cited by-同舟云学术

Thermally enhanced GaN hybrid-IC power amplifier using embedded IC process in a copper sheet

Published:2018-08-11 Issue:9 Volume:60 Page:2262-2267
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw Opt Technol Lett

Author:

Yoon Tae-Woong¹,Kim Dong-Su¹,Yook Jong-Min¹^ORCID

Affiliation:

1. Korea Electronics Technology Institute; ICT Device and Packaging Research Center; Seongnam-si Gyeonggi-do South Korea

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/mop.31333/fullpdf

Reference10 articles.

1. An X-band RLC matched power amplifier using quasi-MMIC technology;An;Microwave Opt Technol Lett.,2015

2. SThM temperature mapping and nonlinear thermal resistance evolution with bias on AlGaN/GaN HEMT devices;Aubry;IEEE Trans Electron Devices.,2007

3. Thermal conductivity of GaN crystals in 4.2-300 K range;Jeżowski;Solid State Commun.,2003

4. Prejs A Wood S Pengelly R Pribble W. 2009

5. Novel packaging, cooling and interconnection method for GaN high performance power amplifiers and GaN based RF front-ends;Margomenos Micovic;EuMIC.,2012

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Additive Approach to Embed Chips in a Metallic Matrix Infused PCB;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Embedded-IC package using Si-interposer for mmWave Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Printed Silver Micro-pillars Embedded in a Phase Change Material Matrix for Thermal Management Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Metal-Embedded Chip Assembly Processing for Enhanced RF Circuit Performance;IEEE Transactions on Microwave Theory and Techniques;2019-09

5. Integrated circuit (IC)‐embedded wafer‐level packaging technology for millimeter‐wave power ICs;Microwave and Optical Technology Letters;2019-06-04