Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
15 articles.
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1. Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
2. Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology;2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS);2023-10-25
3. Adaptable 40 nm GaN T-Gate MMIC Processes for Millimeter-Wave Applications;2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2023-10-16
4. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29
5. Heterogeneously Integrated 6–12 GHz Butler Matrix;2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI);2023-07-23