Assessment of thermal expansion coefficient of methylsilsesquioxane thin film-Reference-Cited by-同舟云学术

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Assessment of thermal expansion coefficient of methylsilsesquioxane thin film

Published:2006 Issue:21 Volume:44 Page:3109-3120
ISSN:0887-6266
Container-title:Journal of Polymer Science Part B: Polymer Physics
language:en
Short-container-title:J. Polym. Sci. B Polym. Phys.

Author:

Kim B. R.,Son J. M.,Ko M. J.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry,Condensed Matter Physics

Reference30 articles.

1. Microchip Fabrication: A Practical Guide to Semiconductor Processing, 4th ed.; McGraw-Hill: New York, 2000.

2. International Technology Roadmap for Semiconductors; Semiconductor Industry Association: Gaithersburg, MD, 2001.

3. Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films

4. Anisotropic Thermal Expansion Behavior of Thin Films of Polymethylsilsesquioxane, a Spin-on-Glass Dielectric for High-Performance Integrated Circuits

5. ToF-SIMS studies of nanoporous PMSSQ materials: kinetics and reactions in the processing of low-K dielectrics for ULSI applications

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Active glass waveguide amplifier on GaAs by UV-pulsed laser deposition and femtosecond laser inscription;Laser Physics Letters;2012-05-01

2. A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels;Journal of Electronic Packaging;2008-07-30

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