All-Copper Interconnects for High-Temperature Applications
Author:
Affiliation:
1. Bangladesh University of Engineering and Technology (BUET); Department of Materials and Metallurgical Engineering; Old Academic Building, Zahir Raihan Road Dhaka 1000 Bangladesh
Publisher
Wiley-VCH Verlag GmbH & Co. KGaA
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch13/fullpdf
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4. Die attach materials for high temperature applications: a review;Manikam;IEEE Transactions on Components, Packaging and Manufacturing Technology,2011
5. Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications;Spinelli;Materials and Design,2014
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