Recent Advancement of Research in Silver-Based Solder Alloys
Author:
Affiliation:
1. Bangladesh University of Engineering and Technology (BUET); Department of Materials and Metallurgical Engineering; Old Academic Building, Zahir Raihan Road Dhaka 1000 Bangladesh
Publisher
Wiley-VCH Verlag GmbH & Co. KGaA
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch10/fullpdf
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3. Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings;Lee;Microelectronics Reliability,2008
4. Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints;Zhong;Journal of Alloys and Compounds,2006
5. Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys;Cheng;Microelectronics Reliability,2012
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