Effects of Ga on Mechanical Properties and Microstructure of Cu–Sn–Ti Filler-Reference-Cited by-同舟云学术

Effects of Ga on Mechanical Properties and Microstructure of Cu–Sn–Ti Filler

Published:2021-12-07 Issue:2 Volume:219 Page:2100203
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Physica Status Solidi (a)

Author:

Li Hailing¹²,Chen Ji²,Cui Bing¹²³^ORCID,Fu Yucan³,Zhao Dan⁴,Li Yujia⁴,Xu Dong²

Affiliation:

1. Anhui Province Key Laboratory of Metallurgy Engineering and Resources Recycling Anhui University of Technology Maanshan 243002 China

2. School of Materials Science and Engineering Anhui University of Technology Maanshan 243002 China

3. College of Mechanical and Electrical Engineering Nanjing University of Aeronautics and Astronautics Nanjing 210016 China

4. China Innovation Academy of Intelligent Equipment Co., Ltd. Ningbo 315700 China

Funder

Natural Science Foundation of Anhui Province

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pssa.202100203

Reference29 articles.

1. Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates

2. Additive manufacturing of metals

3. Laser additive manufacturing of metallic components: materials, processes and mechanisms

4. Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints

5. Additive manufacturing of Cu–10Sn bronze

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