Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-015-8859-6.pdf
Reference58 articles.
1. Cobb HL (1946) Cadmium whiskers. Monthly Rev Am Electroplat Soc 33(28):28–30
2. Compton KG, Mendizz A, Arnolad SM (1951) Filamentary growths on metal surfaces-whiskers. Corrosion 7(10):327–334
3. Arnolad SM (1959) The growth of metal whiskers on electrical components. Proceedings IEEE Electronic Components Technology Conference pp 75–82
4. Galyon GT (2005) Annotated tin whisker bibliography and anthology. IEEE Trans on Electron Packag Manuf 28:94–122
5. Henshall G, Bath J, Handwerker CA (2011) Lead-free solder process development. Wiley, Hoboken
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