X‐ray microscopy and automatic detection of defects in through silicon vias in three‐dimensional integrated circuits-Reference-Cited by-同舟云学术

X‐ray microscopy and automatic detection of defects in through silicon vias in three‐dimensional integrated circuits

Published:2022-05-12 Issue:12 Volume:4 Page:
ISSN:2577-8196
Container-title:Engineering Reports
language:en
Short-container-title:Engineering Reports

Author:

Wolz Benedikt Christopher¹^ORCID,Jaremenko Christian¹²,Vollnhals Florian¹^ORCID,Kling Lasse¹^ORCID,Wrege Jan³,Christiansen Silke¹²^ORCID

Affiliation:

1. Institute for Nanotechnology and Correlative Microscopy gGmbH Forchheim Germany

2. Fraunhofer IKTS Forchheim Germany

3. Siemens Healthineers Forchheim Germany

Funder

Bayerische Staatsministerium für Wirtschaft, Landesentwicklung und Energie

H2020 European Research Council

Publisher

Wiley

Subject

General Engineering,General Computer Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/eng2.12520

Reference59 articles.

1. HummlerK SmithL CaramtoR et al.On the technology and ecosystem of 3D/TSV manufacturing. Proceedings of the SEMI Advanced Semiconductor Manufacturing Conference;2011:1‐6; IEEE Saratoga Springs New York NY.

2. JingX YuD WanL.Non‐destructive testing of through silicon vias by high‐resolution X‐ray/CT techniques. Proceedings of the 14th Electronics Packaging Technology Conference (EPTC);2012:533‐536; IEEE.

3. Measuring thermally induced void growth in conformally filled through-silicon vias (TSVs) by laboratory x-ray microscopy

4. 3D Microelectronic Packaging

5. New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing

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