Affiliation:
1. Department of Electrical and Electronic Engineering Tokyo Institute of Technology Meguro Tokyo 152‐8550 Japan
Abstract
The surface passivation quality of intrinsic hydrogenated amorphous silicon (i‐a‐Si:H) layers deposited by constant DC power‐facing target sputtering (FTS) technology is investigated. An n‐type crystalline silicon wafer passivated with a 42 nm‐thick i‐a‐Si:H shows an effective carrier lifetime of 11 ms, which corresponds to a low upper limit effective surface recombination velocity Seff of 1.27 cm s−1. An ultrathin 5 nm‐thick i‐a‐Si:H film achieves an implied open‐circuit voltage (iVoc) of 730 mV at a high deposition rate of 31 nm min−1. It is found that constant DC‐FTS does not cause sputtering damage under high deposition rate conditions. This work demonstrates that i‐a‐Si:H deposited by constant DC‐FTS can achieve the same passivation quality as i‐a‐Si:H deposited by plasma‐enhanced chemical vapor deposition or catalytic chemical vapor deposition, paving the way for the fabrication of silicon heterojunction solar cells without the use of explosive and toxic gases.
Funder
Japan Science and Technology Agency