Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker-Reference-Cited by-同舟云学术

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Published:2021-09-12 Issue:43 Volume:33 Page:2103104
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Wang Han¹,Xing Wenkui¹,Chen Shen¹,Song Chengyi¹^ORCID,Dickey Michael D.²^ORCID,Deng Tao¹^ORCID

Affiliation:

1. Center of Hydrogen Science, School of Materials Science and Engineering Shanghai Jiao Tong University 800 Dong Chuan Road Shanghai 200240 P. R. China

2. Department of Chemical and Biomolecular Engineering North Carolina State University 911 Partners Way Raleigh NC 27695 USA

Funder

National Natural Science Foundation of China

Higher Education Discipline Innovation Project

National Science Foundation

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202103104

Reference62 articles.

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2. Novel nanostructured thermal interface materials: a review

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4. Recent progress in the development of thermal interface materials: a review

5. Liquid metal architectures for soft and wearable energy harvesting devices

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