Freestanding and Scalable Force‐Softness Bimodal Sensor Arrays for Haptic Body‐Feature Identification-Reference-Cited by-同舟云学术

Freestanding and Scalable Force‐Softness Bimodal Sensor Arrays for Haptic Body‐Feature Identification

Published:2022-10-21 Issue:47 Volume:34 Page:2207016
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

Cui Zequn¹,Wang Wensong²,Xia Huarong¹,Wang Changxian¹,Tu Jiaqi¹³,Ji Shaobo¹,Tan Joel Ming Rui⁴,Liu Zhihua⁵,Zhang Feilong¹,Li Wenlong⁵,Lv Zhisheng⁵,Li Zheng¹,Guo Wei¹,Koh Nien Yue⁶,Ng Kian Bee⁶,Feng Xue⁷,Zheng Yuanjin²,Chen Xiaodong¹⁵⁸^ORCID

Affiliation:

1. Innovative Center for Flexible Devices (iFLEX) & Max Planck–NTU Joint Lab for Artificial Senses School of Materials Science and Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore

2. School of Electrical & Electronic Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore

3. Institute of Flexible Electronics Technology of THU Zhejiang Jiaxing 314000 China

4. School of Materials Science and Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore

5. Institute of Materials Research and Engineering the Agency for Science Technology and Research 2 Fusionopolis Way, Innovis, #08‐03 Singapore 138634 Singapore

6. Lee Kong Chian School of Medicine Novena Campus Nanyang Technological University 11 Mandalay Road Singapore 308232 Singapore

7. Laboratory of Flexible Electronics Technology Tsinghua University Beijing 100190 China

8. Institute for Digital Molecular Analytics and Science (IDMxS) Nanyang Technological University 59 Nanyang Drive Singapore 636921 Singapore

Funder

National Research Foundation

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202207016

Reference36 articles.

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