Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging-Reference-Cited by-同舟云学术

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Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging

Published:2022-08-23 Issue:38 Volume:34 Page:2205120
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

He Hongying¹^ORCID,Peng Weixiang¹,Liu Junbo¹,Chan Xin Ying¹,Liu Shike²,Lu Li³⁴,Le Ferrand Hortense¹²^ORCID

Affiliation:

1. School of Mechanical and Aerospace Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore

2. School of Materials Science and Engineering Nanyang Technological University 50 Nanyang Avenue Singapore 639798 Singapore

3. Department of Mechanical Engineering National University of Singapore 9 Engineering Drive 1 Singapore 117575 Singapore

4. National University of Singapore (Chongqing) Research Institute Chongqing 401123 China

Funder

National Research Foundation Singapore

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202205120

Reference53 articles.

1. Integrated thermal management techniques for high power electronic devices

2. Thermal Management of On-Chip Hot Spot

3. The chips are down for Moore’s law

4. Emerging challenges and materials for thermal management of electronics

5. High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

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3. Enhanced thermal conductivity and anticorrosion capabilities of epoxy composite coating with quercetin-modified boron nitride;Progress in Organic Coatings;2024-12

4. Simulation‐Directed Construction of Bamboo‐Forest‐Like Heat Conduction Networks to Enhance Silicon Rubber Composites’ Heat Conduction Properties;Small;2024-09-12

5. Thermally Conductive Polydimethylsiloxane-Based Composite with a Three-Dimensional Vertically Aligned Thermal Network Incorporating Hexagonal Boron Nitride Nanosheets and Nanodiamonds;Langmuir;2024-09-12

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