Author:
McGlen Ryan J,Jachuck Roshan,Lin Song
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference16 articles.
1. MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics;Amon;Experimental Thermal and Fluid Science,2001
2. The history of power dissipation;Azar;Electronics Cooling,2000
3. Heat transfer and pressure drop in fractal tree-like micro channel nets;Chen;International Journal of Heat and Mass Transfer,2002
4. Water-cooled electronics;Dumont;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment,2000
5. Micro cooling systems for high density packaging;Groll;Revue Generale de Thermique,1998
Cited by
264 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献