MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Published:2001-11 Issue:5 Volume:25 Page:231-242
ISSN:0894-1777
Container-title:Experimental Thermal and Fluid Science
language:en
Short-container-title:Experimental Thermal and Fluid Science

Author:

Amon Cristina H.,Murthy Jayathi,Yao S.C.,Narumanchi Sreekant,Wu Chi-Fu,Hsieh Cheng-Chieh

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Aerospace Engineering,Nuclear Energy and Engineering,General Chemical Engineering

Reference61 articles.

1. Cooling electronic equipment past present and future;Nakayama,1990

2. Boiling heat transfer characteristics of simulated microelectronic chips with detechable heat sinks;Park,1998

3. Effects of size of simulated microelectronic chips on boiling and critical heat flux;Park;Journal of Heat Transfer,1988

4. A method to reduce temperature overshoots in immersion cooling of electronic devices;Bergles,1988

5. The influence of subcooling on the pool nucleate boiling and critical heat flux of simulated electronic chips;Carvalho,1990

Cited by 100 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synergistic thermal management of lithium-ion batteries in electric two-wheelers: Critical analysis and ranking of multifaceted strategies and numerical validation;Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering;2024-08-23

2. Study of combined pump-driven thermosyphon loops in data centers;Eighth International Conference on Energy System, Electricity, and Power (ESEP 2023);2024-05-13

3. Numerical simulation of multi-array spray cooling for hot rolled seamless steel pipes;International Journal of Heat and Mass Transfer;2024-04

4. Review of Operation Performance and Application Status of Pulsating Heat Pipe;Sustainability;2024-03-26

5. Experimental and Computational Investigation of Flow Boiling in a 52 μm Hydraulic Diameter Microchannel Evaporator With Inlet Restrictions and Heat Spreading;ASME Journal of Heat and Mass Transfer;2024-03-15

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3